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LM21215AMHX-1/NOPB Datasheet(PDF) 4 Page - Texas Instruments

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Part No. LM21215AMHX-1/NOPB
Description  15-A Ultra High-Efficiency Synchronous Buck Converter
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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LM21215AMHX-1/NOPB Datasheet(HTML) 4 Page - Texas Instruments

 
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LM21215A
SNOSB87C – MARCH 2011 – REVISED JANUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
PVIN(3) to GND, AVIN to GND
−0.3
6
V
SW(4) to GND
−0.3
VPVIN + 0.3
V
EN, FB, COMP, PGOOD, SS/TRK to GND
−0.3
VPVIN + 0.3
V
Storage temperature, Tstg
−65
150
ºC
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
The PVIN prin can tolerate transient voltages up to 6.5 V for a duration of up to 6 ns. These transients can occur during normal
operation of the device.
(4)
The SW pin can tolerate transient voltages up to 9 V for a duration of 6 ns and –1 V for a duration of 4 ns. These transients can occur
during normal operation of the device.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Input voltages
PVIN, AVIN to GND
2.95
5.5
V
Output current, IOUT
−0.3
15
A
Junction temperature, TJ
−40
125
ºC
6.4 Thermal Information
LM21215A -1
THERMAL METRIC(1)
PWP (HTSSOP)
UNIT
20 PINS
RθJA
Junction-to-ambient thermal resistance
30.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
12.9
°C/W
RθJB
Junction-to-board thermal resistance
0.3
°C/W
ψJT
Junction-to-top characterization parameter
0.3
°C/W
ψJB
Junction-to-board characterization parameter
2.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2011–2016, Texas Instruments Incorporated
Product Folder Links: LM21215A


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