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LM2854 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2854 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page 4 LM2854 SNVS560D – MARCH 2008 – REVISED JANUARY 2016 www.ti.com Product Folder Links: LM2854 Submit Documentation Feedback Copyright © 2008–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) PGND and AGND are electrically connected together on the PC board and the resultant net is termed GND. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT PVIN, AVIN, SW, EN, FB, SS to GND(3) –0.3 6 V Power Dissipation Internally Limited Junction Temperature 150 °C Storage Temperature −65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. Test method is per JESD22-AI14. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V (1) PGND and AGND are electrically connected together on the PC board and the resultant net is termed GND. 6.3 Recommended Operating Conditions MIN MAX UNIT PVIN to GND(1) 2.95 5.5 V AVIN to GND(1) 2.95 5.5 V Junction Temperature −40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM2854 UNIT PWP (HTSSOP) 16 PINS RθJA Junction-to-ambient thermal resistance 38.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 27.6 °C/W RθJB Junction-to-board thermal resistance 17.1 °C/W ψJT Junction-to-top characterization parameter 1.5 °C/W ψJB Junction-to-board characterization parameter 16.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.3 °C/W |
Similar Part No. - LM2854_16 |
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Similar Description - LM2854_16 |
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