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ICPLW136 Datasheet(PDF) 11 Page - ISOCOM COMPONENTS |
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ICPLW136 Datasheet(HTML) 11 Page - ISOCOM COMPONENTS |
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11 / 14 page  11 DC93191 26/01/2016 ICPLW135, ICPLW136, ICPLW4503 ISOCOM COMPONENTS IR REFLOW SOLDERING TEMPERATURE PROFILE (One Time Reflow Soldering is Recommended) TIME (s) 25°C ts Preheat 60s – 120s Tsmin Tsmax 260°C TL 217°C Time 25°C to Peak Temperature tP TP - 5°C TP Max Ramp Up Rate 3°C/s Max Ramp Down Rate 6°C/s TL 200°C 150°C Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s - 120s Soldering Zone - Peak Temperature (TP) - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 217°C 30s 60s - 100s 3°C/s max 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max |
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