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TPS62480RNCT Datasheet(PDF) 4 Page - Texas Instruments |
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TPS62480RNCT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 36 page 4 TPS62480 SLVSCL9A – FEBRUARY 2016 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: TPS62480 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Pin Voltage Range(2) VIN -0.3 6 V SW1, SW2 -0.3 VIN+0.3 V EN, VSEL, MODE, SS/TR, PG, TG -0.3 6 V FB, RS -0.3 3 V Power Good / Thermal Good Sink Current PG, TG 10 mA Operating Junction Temperature Range, TJ -40 150 °C Storage Temperature Range, Tstg -65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±1000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN TYP MAX UNIT Supply Voltage Range, VIN 2.4 5.5 V Output Voltage Range, VOUT 0.6 5.5 V Maximum Output Current, IOUT 6 A Operating junction temperature, TJ –40 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) See the Layout section. 6.4 Thermal Information THERMAL METRIC(1) TPS62480 UNIT RNC 16 PINS JEDEC with thermal vias(2) JEDEC standard RθJA Junction-to-ambient thermal resistance 26.4 56.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 32.2 32.2 °C/W RθJB Junction-to-board thermal resistance 10.2 26.5 °C/W ψJT Junction-to-top characterization parameter 0.9 1.3 °C/W ψJB Junction-to-board characterization parameter 10.2 26.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance - - °C/W |
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