4

TPS763-Q1, TPS76301-Q1, TPS76316-Q1, TPS76318-Q1

TPS76325-Q1, TPS76330-Q1, TPS76333-Q1, TPS76350-Q1

SGLS247B – SEPTEMBER 2011 – REVISED MARCH 2016

www.ti.com

Product Folder Links: TPS763-Q1 TPS76301-Q1 TPS76316-Q1 TPS76318-Q1 TPS76325-Q1 TPS76330-Q1

TPS76333-Q1 TPS76350-Q1

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Copyright © 2011–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

–0.3

10

V

Voltage at EN

V

Voltage on OUT, FB

V

Peak output current

Internally limited

–40

150

°C

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.7

10

V

0

150

mA

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

TPS763xx-Q1

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

205.2

°C/W

Junction-to-case (top) thermal resistance

11.83

°C/W

Junction-to-board thermal resistance

34.8

°C/W

Junction-to-top characterization parameter

12.2

°C/W

Junction-to-board characterization parameter

33.9

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W