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LP5907SNX-1.9 Datasheet(PDF) 5 Page - Texas Instruments |
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LP5907SNX-1.9 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 36 page 5 LP5907 www.ti.com SNVS798J – APRIL 2012 – REVISED MARCH 2016 Product Folder Links: LP5907 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LP5907 UNIT DBV (SOT-23) DQN (X2SON) YKE (DSBGA) 5 PINS 4 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 193.4 216.1 206.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 102.1 161.7 1.5 °C/W RθJB Junction-to-board thermal resistance 45.8 162.1 37.0 °C/W ψJT Junction-to-top characterization parameter 8.4 5.1 15.0 °C/W ψJB Junction-to-board characterization parameter 45.3 161.7 36.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 123.0 n/a °C/W (1) All voltages are with respect to the device GND terminal, unless otherwise stated. (2) Minimum and maximum limits are ensured through test, design, or statistical correlation over the junction temperature (TJ) range of –40°C to 125°C, unless otherwise stated. Typical values represent the most likely parametric norm at TA = 25°C, and are provided for reference purposes only. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See Applications and Implementation. (4) The device maintains a stable, regulated output voltage without a load current. (5) Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT. (6) Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device. (7) Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its nominal value. (8) Short-circuit current (ISC) for the LP5907 is equivalent to current limit. To minimize thermal effects during testing, ISC is measured with VOUT pulled to 100 mV below its nominal voltage. (9) This specification is verified by design. 6.5 Electrical Characteristics VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA, CIN = 1 µF, COUT = 1 µF, unless otherwise stated. (1) (2) (3) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIN Input voltage TA = 25°C 2.2 5.5 V ΔVOUT Output voltage tolerance VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA to 250 mA –2 2 %VOUT VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA to 250 mA (VOUT < 1.8 V, SOT-23, X2SON packages) –3 3 Line regulation VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA 0.02 %/V Load regulation IOUT = 1 mA to 250 mA 0.001 %/mA ILOAD Load current See(4) 0 250 mA Maximum output current 250 IQ Quiescent current(5) VEN = 1.2 V, IOUT = 0 mA 12 25 µA VEN = 1.2 V, IOUT = 250 mA 250 425 VEN = 0.3 V (Disabled) 0.2 1 IG Ground current(6) VEN = 1.2 V, IOUT = 0 mA 14 µA VDO Dropout voltage(7) IOUT = 100 mA 50 mV IOUT = 250 mA (DSBGA package) 120 200 IOUT = 250 mA (SOT-23, X2SON packages) 250 ISC Short circuit current limit TA = 25°C (8) 250 500 mA PSRR Power supply rejection ratio(9) f = 100 Hz, IOUT = 20 mA 90 dB f = 1 kHz, IOUT = 20 mA 82 f = 10 kHz, IOUT = 20 mA 65 f = 100 kHz, IOUT = 20 mA 60 |
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