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172946001 Datasheet(PDF) 11 Page - Wurth Elektronik GmbH & Co. KG, Germany. |
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172946001 Datasheet(HTML) 11 Page - Wurth Elektronik GmbH & Co. KG, Germany. |
11 / 21 page Data Sheet ©2014 Würth Elektronik eiSos GmbH & Co. KG - REV 0.1 PRELIMINARY 11/ 21 172946001 MagI³C Power Module Product Family LDHM - LED Step Down High Current Module Minimum Switch On-Time The on-time of the internal switch should be no shorter than 400 ns. The number of LED (typical forward voltage at 3.2 V) to input voltage is constrained by that as shown in the following table. No. of LED 1 2 3 4 5 6-16 Max. VIN(V) 10 20 30 40 50 60 Step 2. Layout consideration The overall performance of the LED driver module highly depends on the PCB layout. Poor board layout can disrupt the performance of the LED driver module and surrounding circuitry by contributing to EMI, ground bounce and resistive voltage drop in the traces. These can send incorrect signals to the LED driver module resulting in poor regulation and stability. Good layout can be implemented by following a few simple design rules. Place CIN as close as possible to the VIN pin and GND exposed pad (EP). Place COUT (optional for reduction of LED current ripple and EMI compliance) as close as possible to the VLED+ pin and VLED- pin. The exposed pad (EP) must be connected to the GND pin directly. Step 3. EMI design considerations From an EMI reduction standpoint, it is imperative to minimize the di/dt current paths (refer to LED driver module current loops). Therefore, it is essential to connect an 2.2 μF capacitor (COUT) across the LED+ pin and LED- pin. This will minimize the ripple current so that it can reduce radiated EMI. LED driver module current loops 29D CIN LED+ GND LED- Module Loop 1 Loop 2 VIN High Power LED String COUT di/dt |
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