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ISO7321FC Datasheet(PDF) 4 Page - Texas Instruments |
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ISO7321FC Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page ISO7320C, ISO7320FC, ISO7321C, ISO7321FC SLLSEK8C – JANUARY 2015 – REVISED APRIL 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT Supply voltage, VCC1 , VCC2 (2) –0.5 6 V Voltage (2) INx, OUTx –0.5 VCC+ 0.5 (3) V Output current, IO ±15 mA Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal and are peak voltage values. (3) Maximum voltage must not exceed 6 V. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 VESD V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN TYP MAX UNIT VCC1, VCC2 Supply voltage 3 5.5 V IOH High-level output current –4 mA IOL Low-level output current 4 mA VIH High-level input voltage 2 5.5 V VIL Low-level input voltage 0 0.8 V tui Input pulse duration 40 ns 1 / tui Signaling rate 0 25 Mbps TJ (1) Junction temperature 136 °C TA Ambient temperature -40 25 125 °C (1) To maintain the recommended operating conditions for TJ, see the Thermal Information table. 6.4 Thermal Information D PACKAGE THERMAL METRIC(1) UNIT (8) PINS RθJA Junction-to-ambient thermal resistance 121 RθJCtop Junction-to-case (top) thermal resistance 67.9 RθJB Junction-to-board thermal resistance 61.6 °C/W ψJT Junction-to-top characterization parameter 21.5 ψJB Junction-to-board characterization parameter 61.1 RθJCbot Junction-to-case (bottom) thermal resistance N/A PD (ISO7320) Maximum power dissipation by ISO7320 56 VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 PD1 (ISO7320) Maximum power dissipation by side-1 of ISO7320 pF, Input a 12.5 MHz 50% duty-cycle square 15 mW wave PD2 (ISO7320) Maximum power dissipation by side-2 of ISO7320 41 PD (ISO7321) Maximum power dissipation by ISO7321 67 VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 PD1 (ISO7321) Maximum power dissipation by side-1 of ISO7321 pF, Input a 12.5 MHz 50% duty-cycle square 33.5 mW wave PD2 (ISO7321) Maximum power dissipation by side-2 of ISO7321 33.5 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ISO7320C ISO7320FC ISO7321C ISO7321FC |
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