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ISO7321FC Datasheet(PDF) 4 Page - Texas Instruments

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Part # ISO7321FC
Description  Robust EMC, Low Power, Dual-Channel Digital Isolators
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ISO7321FC Datasheet(HTML) 4 Page - Texas Instruments

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ISO7320C, ISO7320FC, ISO7321C, ISO7321FC
SLLSEK8C – JANUARY 2015 – REVISED APRIL 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Supply voltage, VCC1 , VCC2
(2)
–0.5
6
V
Voltage (2)
INx, OUTx
–0.5
VCC+ 0.5
(3)
V
Output current, IO
±15
mA
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal and are peak voltage values.
(3)
Maximum voltage must not exceed 6 V.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±4000
VESD
V
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
±1500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
TYP
MAX
UNIT
VCC1, VCC2
Supply voltage
3
5.5
V
IOH
High-level output current
–4
mA
IOL
Low-level output current
4
mA
VIH
High-level input voltage
2
5.5
V
VIL
Low-level input voltage
0
0.8
V
tui
Input pulse duration
40
ns
1 / tui
Signaling rate
0
25
Mbps
TJ
(1)
Junction temperature
136
°C
TA
Ambient temperature
-40
25
125
°C
(1)
To maintain the recommended operating conditions for TJ, see the Thermal Information table.
6.4 Thermal Information
D PACKAGE
THERMAL METRIC(1)
UNIT
(8) PINS
RθJA
Junction-to-ambient thermal resistance
121
RθJCtop
Junction-to-case (top) thermal resistance
67.9
RθJB
Junction-to-board thermal resistance
61.6
°C/W
ψJT
Junction-to-top characterization parameter
21.5
ψJB
Junction-to-board characterization parameter
61.1
RθJCbot
Junction-to-case (bottom) thermal resistance
N/A
PD (ISO7320)
Maximum power dissipation by ISO7320
56
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15
PD1 (ISO7320)
Maximum power dissipation by side-1 of ISO7320
pF, Input a 12.5 MHz 50% duty-cycle square
15
mW
wave
PD2 (ISO7320)
Maximum power dissipation by side-2 of ISO7320
41
PD (ISO7321)
Maximum power dissipation by ISO7321
67
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15
PD1 (ISO7321)
Maximum power dissipation by side-1 of ISO7321
pF, Input a 12.5 MHz 50% duty-cycle square
33.5
mW
wave
PD2 (ISO7321)
Maximum power dissipation by side-2 of ISO7321
33.5
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: ISO7320C ISO7320FC ISO7321C ISO7321FC


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