DRV10963

SLAS955A – MARCH 2013 – REVISED JULY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VCC Pin supply voltage

–0.3

6

V

Motor phase pins (U, V, W)

–1

7.7

V

Direction, speed indicator input, and speed input (FR, FGS, PWM)

–0.3

6

V

Speed output (FG)

–0.3

7.7

V

Junction temperature

–40

150

°C

Maximum lead soldering temperature, 10 seconds

260

°C

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground.

6.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

VCC Pin supply voltage

2.1

5.5

V

U, V, W

Motor phase pins

–0.1

7

V

FR, FGS,

Direction, speed indicator input, and speed input

–0.1

5.5

V

PWM

FG

Speed output

–0.1

7.5

V

Junction temperature

–40

125

°C

6.4 Thermal Information

DRV10963

DSN (USON)

UNIT

10 PINS

Junction-to-ambient thermal resistance

40.9

°C/W

Junction-to-case (top) thermal resistance

46.6

°C/W

Junction-to-board thermal resistance

15.8

°C/W

Junction-to-top characterization parameter

0.5

°C/W

Junction-to-board characterization parameter

16

°C/W

Junction-to-case (bottom) thermal resistance

2.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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