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DRV10963 Datasheet(PDF) 22 Page - Texas Instruments

Part No. DRV10963
Description  DRV10963 5-V, Three-Phase, Sensorless BLDC Motor Driver
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

DRV10963 Datasheet(HTML) 22 Page - Texas Instruments

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10
9
8
7
1
2
3
4
5
FG
FGS
VCC
W
FR
PWM
100k
GND
100k
GND
(PPAD)
GND
6
GND
2.2uF
U
V
DRV10963
SLAS955A – MARCH 2013 – REVISED JULY 2015
www.ti.com
9 Power Supply Recommendations
The DRV10963 is designed to operate from an input voltage supply, V(VCC), range from 2.1 and 5.5 V. The user
must place a 2.2-
μF ceramic capacitor rated for VCC as close as possible to the VCC and GND pin.
10 Layout
10.1 Layout Guidelines
The package uses an exposed pad to remove heat from the device. For proper operation, this pad must be
thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane, this can
be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs without
internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area is on
the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and bottom
layers.
For details about how to design the PCB, refer to TI application report, PowerPAD™ Thermally Enhanced
Package (SLMA002), and TI application brief, PowerPAD™ Made Easy (SLMA004), available at www.ti.com. In
general, the more copper area that can be provided, the more power can be dissipated.
10.2 Layout Example
Figure 22. DRV10963 Layout Example
22
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Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: DRV10963


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