2

FN6587.1

February 18, 2008

Ordering Information

PART NUMBER

(Notes 1, 2)

PART MARKING

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG. DWG. #

ISL3259EIBZ

3259 EIBZ

-40 to +85

8 Ld SOIC

M8.15

ISL3259EIUZ

3259Z

-40 to +85

8 Ld MSOP

M8.118

ISL3259EIRZ

3259

-40 to +85

10 Ld 3x3 DFN

L10.3x3C

NOTES:

1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte

tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC

J STD-020.

Pinouts

ISL3259E

(8 LD MSOP, SOIC)

TOP VIEW

ISL3259E

(10 LD DFN)

TOP VIEW

RO

RE

DE

DI

1

2

3

4

8

7

6

5

B/Z

A/Y

GND

D

R

2

3

4

1

5

9

8

7

10

6

RO

RE

DE

DI

NC

NC

B/Z

A/Y

GND

Truth Table

TRANSMITTING

INPUTS

OUTPUTS

RE

DE

DI

B/Z

A/Y

X

1101

X

1010

0

0

X

High-Z

High-Z

1

0

X

High-Z*

High-Z*

NOTE: *Shutdown Mode

Truth Table

RECEIVING

INPUTS

OUTPUT

RE

DE

A-B

RO

00

≥-0.05V

1

00

≤-0.2V

0

0

0

Inputs Open/Shorted

1

1

1

X

High-Z

1

0

X

High-Z*

NOTE: *Shutdown Mode

ISL3259E