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SRF55V10PY2.0 Datasheet(PDF) 4 Page - Infineon Technologies AG |
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SRF55V10PY2.0 Datasheet(HTML) 4 Page - Infineon Technologies AG |
4 / 9 page my-d vicinity SRF 55V10P Short Product Information 4 / 9 2002-07-30 Document References ― Confidential Data Sheet ― Qualification report chip ― Chip delivery specification for wafer with chip-layout (die size, orientation, …) ― Module specification containing description of package, product logistic etc. ― Qualification report module ― Inlay specification containing description of package, product logistic etc. ― Qualification report inlay Development Tool Overview ― my-d vicinity evaluation and demonstration kit 1 Ordering and Packaging information Table 1 Ordering Information Type Package1) Memory Pages Ordering Code User Admin. SRF 55V10P C Die Q67100H4851 SRF 55V10P MCC8 P-MCC8-2-1 on request SRF 55V10P Y1.0 Inlay 45 x 45 mm2 Q67100H4868 SRF 55V10P Y2.0 Inlay 45 x 76 mm2 1024 bytes 256 bytes 128 Q67100H4869 1) Available as a die (C) for customer packaging, as inlay (Y) or as a Module Contactless Card (MCC) for embedding in plastic cards |
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