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P0603V24 Datasheet(PDF) 5 Page - Protek Devices |
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P0603V24 Datasheet(HTML) 5 Page - Protek Devices |
5 / 8 page Only One Name Means ProTek’Tion™ www.protekdevices.com 05442.R1 3/14 Page 5 P0603V24 SOLDER REFLOW INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Rectangular Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C T P 30-60 seconds Ramp-Up 15 seconds (Minimize) Solder-Time 15-20 seconds Ramp-Down Ramp-Down Solder Melt (Maximum Temp) Maximum Solder Reflow (35-53°C Above Maximum Solder Melt Temp) Ramp-Up Preheat (Stay Below Flux Activation Temp) REQUIREMENTS Temperature: T P for Lead-Free (Sn/Ag/Cu): 260-270°C T P for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activa- tion temperature, component size, weight, surface area and plating. |
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