DRV8850

SLVSCC0B – NOVEMBER 2013 – REVISED DECEMBER 2015

www.ti.com

Pin Functions (continued)

PIN

DESCRIPTION

EXTERNAL COMPONENTS OR CONNECTIONS

NAME

NO.

OUTPUT

OUT1

2, 3, 4

O

Output 1

Connect to motor winding

OUT2

18, 19, 20

O

Output 2

Output current is proportional to H-bridge current. 1 k

Ω, 1%

VPROPI

16

O

Current sense output

resistor to GND for 2-A maximum current with VCC at 2 V. See

Equation 1 if more current is required

Table 1. External Components

PIN

DESCRIPTION

NAME

NO.

LDO regulator

LDOFB

14

Resistor divider from LDOUT sets LDO output voltage.

feedback

LDOOUT

15

LDO regulator output

Bypass to GND with a 2.2-

μF 6.3-V ceramic capacitor.

SR

11

Slew rate control

Resistor to ground sets output slew rate GND to 2.4 M

Ω.

VCC

21, 22, 23

Device supply

Bypass to GND with 0.1-

μF and 10-μF 6.3-V ceramic capacitors.

VCP

17

Charge pump

Connect a 0.1-

μF 6.3-V ceramic capacitor to VCC

Output current is proportional to H-bridge current. 1 k

Ω, 1% resistor to GND for 2-A

VPROPI

16

Current sense output

max current with VCC at 2 V. See Equation 1 for if more current is required.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Power supply voltage, VCC

–0.3

7

V

Charge pump, VCP

–0.3

VCC + 7

V

Digital pin voltage, LDOEN, IN1H, IN1L, IN2H, IN2L, nSLEEP

–0.5

7

V

Other pins, OUT1, OUT2, SR, LDOUT, LDOFB, VPROPI

–0.3

7

V

Peak motor drive output current, OUT1, OUT2

Internally Limited

A

LDO output current, LDOOUT

Internally Limited

A

Operating junction temperature

–40

150

°C

Storage temperature

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

4

Submit Documentation Feedback

Copyright © 2013–2015, Texas Instruments Incorporated

Product Folder Links: DRV8850