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Data Sheet

SMLP34 Series

2014.11 - Rev.I

7/8

3. Others

3-1. Surrounding Gas

Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it

may result in low soldering ability (caused by the change in quality of the plating surface ) or optical

characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste) materials.

All of the above will cause function failure of the products.

Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of

the surrounding parts of the products and the atmospheric environment).

3-2. Electrostatic Damage

The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the

electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and

earthing of production equipment. The resistance values of electrostatic discharge (actual values) vary with

products, therefore, please call our Sales staffs for inquiries.

3-3. Electromagnetic Wave

Please concern the influence on LED in case of application with strong electromagnetic wave such as IH

(Induction heating).

4.Mounting

4-1. Soldering

• No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion

and moisture absorption at humidity will cause heat stress during soldering process and finally has bad

influence on the product’s reliability.

• The product is not for flow soldering.

• Do not expose the product in the environment of high temperature (over 100ºC) or rapid temperature shift

(within 3ºC of temperature gradient) during the flow soldering of surrounding parts.

• Please set appropriate reflow temperature based on our product usage conditions and specification.

• The max for reflowing is 2 times, please finish the second flow soldering and flow soldering with other parts

within the usage limitation after open the moistureproof package.

• Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the

discoloration of the resin.

4-2. Automatic Mounting

4-2-1.Silicon Resin Sealing Product

The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress directly

on the sealing section.

4-2-2.Mini Package (Smaller than 1006 size)

Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top

cover tape. Therefore, the magnet should be set on parts feeder cassette of the mounter to control the product

stabilization. In addition, it is recommended to set ionizer to prevent electrostatic charge.

4-3. Mounting Location

The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or

damage of LED internal junction, therefore, please concern the mounting direction and position to avoid bending

or screwing with great stress of the circuit board.