DRV8814

www.ti.com

SLVSAB9E – MAY 2010 – REVISED NOVEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted.

(1)

MIN

MAX

UNIT

Power supply voltage range

VMx

–0.3

47

V

Power supply ramp rate

VMx

1

V/µs

Digital pin voltage range

–0.5

7

V

Input voltage

–0.3

4

V

–0.8

0.8

V

Peak motor drive output current, t < 1

μS

Internally limited

A

0

2.5

A

Continuous total power dissipation

See Thermal Information

–40

150

°C

–40

85

°C

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Transients of ±1 V for less than 25 ns are acceptable.

(3)

Power dissipation and thermal limits must be observed.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

8

45

V

1

3.5

V

V3P3OUT load current

0

1

mA

Externally applied PWM frequency

0

100

kHz

(1)

(2)

Operational at VREF between 0 V and 1 V, but accuracy is degraded.

6.4 Thermal Information

DRV8814

PWP (HTSSOP)

UNIT

28 PINS

Junction-to-ambient thermal resistance

31.6

°C/W

Junction-to-case (top) thermal resistance

15.9

°C/W

Junction-to-board thermal resistance

5.6

°C/W

Junction-to-top characterization parameter

0.2

°C/W

Junction-to-board characterization parameter

5.5

°C/W

Junction-to-case (bottom) thermal resistance

1.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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