DRV8801-Q1

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SLVSAS7B – FEBRUARY 2011 – REVISED JANUARY 2016

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

40

V

Output current

0

2.8

A

Sense voltage

–500

500

mV

VBB to OUTx

36

V

OUTx to SENSE

36

V

–0.3

7

V

Continuous total power dissipation

See Thermal Information

Operating free-air temperature

–40

125

°C

Maximum junction temperature

–40

150

°C

Storage temperature

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

MIN

MAX

UNIT

–2000

2000

Corner pins (1, 4, 5, 8,

Electrostatic discharge

–750

750

V

Charged device model (CDM), per

9, 12, 13, and 16)

AEC Q100-011

Other pins

–500

500

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Power supply voltage

8

38

V

Logic voltage

0

5.5

V

Applied PWM signal (PHASE and ENABLE)

0

100

kHz

Ambient temperature

–40

125

°C

6.4 Thermal Information

DRV8801-Q1

RTY (QFN)

UNIT

16 PINS

Junction-to-ambient thermal resistance

46.1

°C/W

Junction-to-case (top) thermal resistance

43.0

°C/W

Junction-to-board thermal resistance

22.5

°C/W

Junction-to-top characterization parameter

0.6

°C/W

Junction-to-board characterization parameter

22.5

°C/W

Junction-to-case (bottom) thermal resistance

3.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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