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RF430CL330HCPWR Datasheet(PDF) 8 Page - Texas Instruments |
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RF430CL330HCPWR Datasheet(HTML) 8 Page - Texas Instruments |
8 / 47 page RF430CL330H SLAS916C – NOVEMBER 2012 – REVISED NOVEMBER 2014 www.ti.com 4.8 Thermal Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER VALUE UNIT θJA Junction-to-ambient thermal resistance, still air(1) 116.0 °C/W θJC(TOP) Junction-to-case (top) thermal resistance(2) 45.1 °C/W θJB Junction-to-board thermal resistance(3) TSSOP-14 (PW) 57.6 °C/W ΨJB Junction-to-board thermal characterization parameter 57.0 °C/W ΨJT Junction-to-top thermal characterization parameter 4.6 °C/W θJA Junction-to-ambient thermal resistance, still air(1) 48.8 °C/W θJC(TOP) Junction-to-case (top) thermal resistance(2) 60.8 °C/W θJB Junction-to-board thermal resistance(3) 21.9 °C/W VQFN-16 (RGT) ΨJB Junction-to-board thermal characterization parameter 21.9 °C/W ΨJT Junction-to-top thermal characterization parameter 1.5 °C/W θJC(BOT) Junction-to-case (bottom) thermal resistance(4) 7.1 °C/W (1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. 8 Specifications Copyright © 2012–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: RF430CL330H |
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