RF430CL330H

SLAS916C – NOVEMBER 2012 – REVISED NOVEMBER 2014

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4.8

Thermal Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

VALUE

UNIT

116.0

°C/W

45.1

°C/W

TSSOP-14 (PW)

57.6

°C/W

Junction-to-board thermal characterization parameter

57.0

°C/W

Junction-to-top thermal characterization parameter

4.6

°C/W

48.8

°C/W

60.8

°C/W

21.9

°C/W

VQFN-16 (RGT)

Junction-to-board thermal characterization parameter

21.9

°C/W

Junction-to-top thermal characterization parameter

1.5

°C/W

7.1

°C/W

(1)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(2)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(4)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

8

Specifications

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