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MSP430FR5969 Datasheet(PDF) 25 Page - Texas Instruments |
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MSP430FR5969 Datasheet(HTML) 25 Page - Texas Instruments |
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25 / 132 page  MSP430FR5969, MSP430FR59691, MSP430FR5968, MSP430FR5967 MSP430FR5959, MSP430FR5958, MSP430FR5957 MSP430FR5949, MSP430FR5948, MSP430FR5947, MSP430FR59471 www.ti.com SLAS704E – OCTOBER 2012 – REVISED MARCH 2015 5.12.2 Reset Timing Table 5-3. Reset Input over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT 2.2 V, t(RST) External reset pulse duration on RST(1) 2 µs 3.0 V (1) Not applicable if RST/NMI pin configured as NMI. 5.12.3 Clock Specifications Table 5-4. Low-Frequency Crystal Oscillator, LFXT(1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT fOSC = 32768 Hz, LFXTBYPASS = 0, LFXTDRIVE = {0}, 3.0 V 180 TA = 25°C, CL,eff = 3.7 pF, ESR ≈ 44 kΩ fOSC = 32768 Hz, LFXTBYPASS = 0, LFXTDRIVE = {1}, 3.0 V 185 TA = 25°C, CL,eff = 6 pF, ESR ≈ 40 kΩ IVCC.LFXT Current consumption nA fOSC = 32768 Hz, LFXTBYPASS = 0, LFXTDRIVE = {2}, 3.0 V 225 TA = 25°C, CL,eff = 9 pF, ESR ≈ 40 kΩ fOSC = 32768 Hz, LFXTBYPASS = 0, LFXTDRIVE = {3}, 3.0 V 330 TA = 25°C, CL,eff = 12.5 pF, ESR ≈ 40 kΩ fLFXT LFXT oscillator crystal frequency LFXTBYPASS = 0 32768 Hz Measured at ACLK, DCLFXT LFXT oscillator duty cycle 30% 70% fLFXT = 32768 Hz LFXT oscillator logic-level fLFXT,SW LFXTBYPASS = 1(2) (3) 10.5 32.768 50 kHz square-wave input frequency LFXT oscillator logic-level DCLFXT, SW LFXTBYPASS = 1 30% 70% square-wave input duty cycle LFXTBYPASS = 0, LFXTDRIVE = {1}, 210 fLFXT = 32768 Hz, CL,eff = 6 pF Oscillation allowance for OALFXT k Ω LF crystals(4) LFXTBYPASS = 0, LFXTDRIVE = {3}, 300 fLFXT = 32768 Hz, CL,eff = 12.5 pF (1) To improve EMI on the LFXT oscillator, the following guidelines should be observed. • Keep the trace between the device and the crystal as short as possible. • Design a good ground plane around the oscillator pins. • Prevent crosstalk from other clock or data lines into oscillator pins LFXIN and LFXOUT. • Avoid running PCB traces underneath or adjacent to the LFXIN and LFXOUT pins. • Use assembly materials and processes that avoid any parasitic load on the oscillator LFXIN and LFXOUT pins. • If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins. (2) When LFXTBYPASS is set, LFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this datasheet. Duty cycle requirements are defined by DCLFXT, SW. (3) Maximum frequency of operation of the entire device cannot be exceeded. (4) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the LFXTDRIVE settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following guidelines, but should be evaluated based on the actual crystal selected for the application: • For LFXTDRIVE = {0}, CL,eff = 3.7 pF. • For LFXTDRIVE = {1}, CL,eff = 6 pF • For LFXTDRIVE = {2}, 6 pF ≤ CL,eff ≤ 9 pF • For LFXTDRIVE = {3}, 9 pF ≤ CL,eff ≤ 12.5 pF Copyright © 2012–2015, Texas Instruments Incorporated Specifications 25 Submit Documentation Feedback Product Folder Links: MSP430FR5969 MSP430FR59691 MSP430FR5968 MSP430FR5967 MSP430FR5959 MSP430FR5958 MSP430FR5957 MSP430FR5949 MSP430FR5948 MSP430FR5947 MSP430FR59471 |
Similar Part No. - MSP430FR5969_15 |
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Similar Description - MSP430FR5969_15 |
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