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MSP430FR2033 Datasheet(PDF) 17 Page - Texas Instruments |
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MSP430FR2033 Datasheet(HTML) 17 Page - Texas Instruments |
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17 / 89 page  MSP430FR2033, MSP430FR2032 www.ti.com SLASE45B – OCTOBER 2014 – REVISED AUGUST 2015 5.10 Typical Characteristics - Current Consumption Per Module MODULE TEST CONDITIONS REFERENCE CLOCK TYP UNIT Timer_A Module input clock 5 µA/MHz eUSCI_A UART mode Module input clock 7 µA/MHz eUSCI_A SPI mode Module input clock 5 µA/MHz eUSCI_B SPI mode Module input clock 5 µA/MHz eUSCI_B I2C mode, 100 kbaud Module input clock 5 µA/MHz RTC 32 kHz 85 nA CRC From start to end of operation MCLK 8.5 µA/MHz 5.11 Thermal Characteristics PARAMETERS VALUE UNIT θJA Junction-to-ambient thermal resistance, still air(1) 61.7 °C/W θJC, (TOP) Junction-to-case (top) thermal resistance (2) 25.4 °C/W θJB Junction-to-board thermal resistance(3) LQFP-64 (PM) 32.7 °C/W ΨJB Junction-to-board thermal characterization parameter 32.4 °C/W ΨJT Junction-to-top thermal characterization parameter 2.5 °C/W θJA Junction-to-ambient thermal resistance, still air( (1) 62.4 °C/W θJC, (TOP) Junction-to-case (top) thermal resistance (2) 18.7 °C/W θJB Junction-to-board thermal resistance(3) TSSOP-56 (DGG56) 31.4 °C/W ΨJB Junction-to-board thermal characterization parameter 31.1 °C/W ΨJT Junction-to-top thermal characterization parameter 0.8 °C/W θJA Junction-to-ambient thermal resistance, still air( (1) 68.9 °C.W θJC, (TOP) Junction-to-case (top) thermal resistance (2) 23 °C/W θJB Junction-to-board thermal resistance(3) TSSOP-48 (DGG48) 35.8 °C/W ΨJB Junction-to-board thermal characterization parameter 35.3 °C/W ΨJT Junction-to-top thermal characterization parameter 1.1 °C/W (1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (2) The junction-to-case (top) thermal resistance is obtained by simulating a cold place test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold place fixture to control the PCB temperature, as described in JESD51-8. Copyright © 2014–2015, Texas Instruments Incorporated Specifications 17 Submit Documentation Feedback Product Folder Links: MSP430FR2033 MSP430FR2032 |
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