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54F374DM Datasheet(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part No. 54F374DM
Description  Octal D-Type Flip-Flop with TRI-STATE Outputs
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Maker  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
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54F374DM Datasheet(HTML) 4 Page - National Semiconductor (TI)

   
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AC Electrical Characteristics
74F
54F
74F
TA ea25 C
TA VCC e Mil
TA VCC e Com
Symbol
Parameter
VCC ea50V
CL e 50 pF
CL e 50 pF
Units
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
fmax
Maximum Clock Frequency
100
140
60
70
MHz
tPLH
Propagation Delay
40
65
85
40
105
40
100
ns
tPHL
CP to On
40
65
85
40
110
40
100
tPZH
Output Enable Time
20
90
115
20
140
20
125
tPZL
20
58
75
20
100
20
85
ns
tPHZ
Output Disable Time
20
53
70
20
80
20
80
tPLZ
15
43
55
15
75
15
65
AC Operating Requirements
74F
54F
74F
Symbol
Parameter
TA ea25 C
TA VCC e Mil
TA VCC e Com
Units
VCC ea50V
Min
Max
Min
Max
Min
Max
ts(H)
Setup Time HIGH or LOW
20
25
20
ts(L)
Dn to CP
20
20
20
ns
th(H)
Hold Time HIGH or LOW
20
20
20
th(L)
Dn to CP
20
25
20
tw(H)
CP Pulse Width
70
70
70
ns
tw(L)
HIGH or LOW
60
60
60
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
374
S
C
X
Temperature Range Family
Special Variations
74FeCommercial
QB e Military grade device with
54FeMilitary
environmental and burn-in
processing
Device Type
X e Devices shipped in 13 reel
Package Code
Temperature Range
P e Plastic DIP
CeCommercial (0 Cto a70 C)
D e Ceramic DIP
MeMilitary (b55 Cto a125 C)
F e Flatpak
NOTE
L e Leadless Chip Carrier (LCC)
Not required for MSA package code
S e Small Outline SOIC JEDEC
SJ e Small Outline SOIC EIAJ
MSA e Shrink Small Outline (EIAJ SSOP)
4


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