183

183

Soldering time

Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA（K）or CC（T）at soldering portion（copper foil surface）.

A heat resisting tape should be used for fixed measurement.

3. Temperature profile

300

200

100

A max.

B

C

Time (s)

20 max.

E max.

Pre-heating

D max.

F

Room

temperature

1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's

temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated

conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.

Notes

SSGM

F（s）

Series（Reflow type）

250

240

----

----

150

180

A（℃）

3s max.

B（℃）

C（℃）

D（s）

E（s）

Dip soldering

Soldering temperature

Duration of immersion

Preheating temperature

Preheating time

350±5℃

120℃ max.

90s max.

5s max.

270±5℃

10±1s max.

Soldering temperature

Items

Reference for Hand Soldering Condition

Reference for Dip Soldering Condition

(For insertion terminal types)

Dual In-line Package Type Switches Soldering Conditions