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ISO7221CDG4 Datasheet(PDF) 25 Page - Texas Instruments

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Part # ISO7221CDG4
Description  Dual Channel Digital Isolators
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ISO7221CDG4 Datasheet(HTML) 25 Page - Texas Instruments

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10 mils
10 mils
40 mils
r ~ 4.5
Keep this
space free
from planes,
traces, pads,
and vias
Ground plane
Power plane
Low-speed traces
High-speed traces
ISO7220A, ISO7220B, ISO7220C, ISO7220M
ISO7221A, ISO7221B, ISO7221C, ISO7221M
10 Power Supply Recommendations
To ensure reliable operation at all data rates and supply voltages, a 0.1-
μF bypass capacitor is recommended at
input and output supply pins (VCC1 and VCC2). The capacitors should be placed as close to the supply pins as
possible. If only a single primary-side power supply is available in an application, isolated power can be
generated for the secondary-side with the help of a transformer driver such as Texas Instruments SN6501 data
sheet. For such applications, detailed power supply design and transformer selection recommendations are
available in the data sheet, SN6501 Transformer Driver for Isolated Power Supplies (SLLSEA0).
11 Layout
11.1 Layout Guidelines
A minimum of four layers are required to accomplish a low EMI PCB design (see Figure 23). Layer stacking
should be in the following order (top-to-bottom): high-speed signal layer, ground plane, power plane and low-
frequency signal layer.
Route the high-speed traces on the top layer to avoid the use of vias (and the introduction of the inductances)
and allow for clean interconnects between the isolator and the transmitter and receiver circuits of the data
Place a solid ground plane next to the high-speed signal layer to establish controlled impedance for
transmission line interconnects and provide an excellent low-inductance path for the return current flow.
Place the power plane next to the ground plane to create additional high-frequency bypass capacitance of
approximately 100 pF/in2.
Route the slower speed control signals on the bottom layer to allow for greater flexibility as these signal links
usually have margin to tolerate discontinuities such as vias.
If an additional supply voltage plane or signal layer is needed, add a second power or ground plane system to
the stack to keep it symmetrical. Adding a second plane system to the stack makes the stack mechanically
stable and prevents it from warping. The power and ground plane of each power system can be placed closer
recommendations, see Application Note Digital Isolator Design Guide (SLLA284).
11.1.1 PCB Material
For digital circuit boards operating below 150 Mbps, (or rise and fall times higher than 1 ns), and trace lengths of
up to 10 inches, use standard FR-4 epoxy-glass as PCB material. FR-4 (Flame Retardant 4) meets the
requirements of Underwriters Laboratories UL94-V0, and is preferred over cheaper alternatives because of its
lower dielectric losses at high frequencies, less moisture absorption, greater strength and stiffness, and self-
extinguishing flammability characteristics.
11.2 Layout Example
Figure 23. Recommended Layer Stack
Copyright © 2006–2015, Texas Instruments Incorporated
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Product Folder Links: ISO7220A ISO7220B ISO7220C ISO7220M ISO7221A ISO7221B ISO7221C ISO7221M

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