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54F174DM Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part No. 54F174DM
Description  Hex D Flip-Flop with Master Reset
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Maker  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
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54F174DM Datasheet(HTML) 5 Page - National Semiconductor (TI)

   
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Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
174
S
C
X
Temperature Range Family
Special Variations
74F e Commercial
QB e Military grade device with
54F e Military
environmental and burn-in
processing
Device Type
X e Devices shipped in 13 reel
Package Code
Temperature Range
P e Plastic DIP
C e Commercial (0 Cto a70 C)
D e Ceramic DIP
M e Military (b55 Cto a125 C)
F e Flatpak
L e
Leadless Chip Carrier (LCC)
S e Small Outline SOIC JEDEC
SS e Small Outline SOIC EIAJ
Physical Dimensions inches (millimeters)
20-Terminal Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
5


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