1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

Y

B

Z

A

GND2

GND2

NC

R

RE

D

D1

DE

GND1

D2

V

CC1

V

CC2

ISO35T

www.ti.com

SLLSE26D – NOVEMBER 2010 – REVISED OCTOBER 2015

5 Pin Configuration and Functions

DW Package

16-Pin SOIC

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

A

14

I

Non-inverting Receiver Input

B

13

I

Inverting Receiver Input

D

8

I

Driver Input

D1

1

O

Transformer Driver Terminal 1, Open-Drain Output

D2

2

O

Transformer Driver Terminal 2, Open-Drain Output

DE

7

I

Driver Enable Input

GND1

3

–

Logic-side Ground

GND2

9, 15

–

Bus-side Ground. Both pins are internally connected.

NC

10

–

No Connect. This pin is not connected to any internal circuitry.

R

5

O

Receiver Output

RE

6

I

Receiver Enable Input. This pin has complementary logic.

4

–

Logic-side Power Supply

16

–

Bus-side Power Supply

Y

11

O

Non-inverting Driver Output

Z

12

O

Inverting Driver Output

6 Specifications

6.1 Absolute Maximum Ratings

See

(1)

MIN

MAX

UNIT

–0.3

6

V

Voltage at any bus I/O terminal (A, B, Y, Z)

–9

14

V

Voltage at D1, D2

14

V

Voltage input, transient pulse through 100

Ω, see Figure 22 (A,B,Y,Z)

–50

50

V

Voltage input at any D, DE or RE terminal

–0.5

7

V

Receiver output current

–10

10

mA

Transformer Driver Output Current

450

mA

Maximum junction temperature

170

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values.

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