TPD12S016

SLLSE96F – SEPTEMBER 2011 – REVISED OCTOBER 2015

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6.3 Recommended Operating Conditions

over recommended operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

1.1

3.6

V

Supply voltage

4.5

5.5

V

SCL_A, SDA_A

V

CEC_A

V

CT__HPD, LS_OE

1.0

V

High-level input voltage

SCL_B, SDA_B

5V_OUT = 5.0 V

0.7 × 5V_OUT

5V_OUT

V

CEC_B

5V_OUT = 5.0 V

(1)

HPD_B

5V_OUT = 5.0 V

2.0

5V_OUT

SCL_A, SDA_A

–0.5

V

CEC_A

–0.5

V

CT_HPD, LS_OE

–0.5

0.4

V

Low-level input voltage

SCL_B, SDA_B

5V_OUT = 5.0 V

–0.5

0.3 × 5V_OUT

V

CEC_B

5V_OUT = 5.0 V

–0.5

V

HPD_B

5V_OUT = 5.0 V

0

0.8

V

(contention) Low-level

SCL_A, SDA_A, CEC_A

–0.5

V

input voltage

SCL_A, SDA_A, CEC_A

mV

Operating free-air temperature

–40

85

°C

(1)

6.4 Thermal Information

TPD12S016

RKT (UQFN)

PW (TSSOP)

UNIT

24 PINS

24 PINS

Junction-to-ambient thermal resistance

77.9

88.9

°C/W

Junction-to-case (top) thermal resistance

24.0

26.5

°C/W

Junction-to-board thermal resistance

29.3

43.5

°C/W

Junction-to-top characterization parameter

0.5

1.1

°C/W

Junction-to-board characterization parameter

29.3

43.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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