BALF-NRF01D3 datasheet(6/11 Pages) STMICROELECTRONICS

Part #	BALF-NRF01D3

Description	50 ??nominal input / conjugate match balun to nRF51822-QFAAG0 /QFABB0 and nRF51422-QFAAE0 with integrated harmonic filter

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

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Package information

BALF-NRF01D3

6/11

DocID026031 Rev 2

3

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 10. Package dimensions (top and side view)

Figure 11. Footprint - non solder mask

defined

Figure 12. Footprint - solder mask defined

600 µm

219 µm

205 µm

SE

GND

VCC

DIFF

1500 ± 50µm

500

µm

433 µm

400 µm

630 µm ± 60

Copper pad diameter:

220µm recommended

180µm minimum

260µm maximum

Solder mask opening:

320µm recommended

300µm minimum

340µm maximum

Solder stencil opening:

220µm recommended

Line to connect copper pad on solder mask opening

shopuld be smaller than copper pad diameter

Solder mask opening:

220µm recommended

180µm minimum

260µm maximum

Copper pad diameter:

320µm recommended

300µm minimum

Solder stencil opening :

220µm recommended

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BALF-NRF01D3 Datasheet(PDF) 6 Page - STMicroelectronics

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