4

SN65HVD1780-Q1, SN65HVD1781-Q1, SN65HVD1782-Q1

SLLSE49B – SEPTEMBER 2010 – REVISED JANUARY 2016

www.ti.com

Product Folder Links: SN65HVD1780-Q1 SN65HVD1781-Q1 SN65HVD1782-Q1

Submit Documentation Feedback

Copyright © 2010–2016, Texas Instruments Incorporated

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings—AEC

VALUE

UNIT

Electrostatic

discharge

Bus terminals and GND

±16000

V

All pins

±4000

Charged-device model (CDM), per AEC Q100-011

±2000

Machine Model (MM), AEC-Q100-003

±400

6.3 ESD Ratings—IEC

VALUE

UNIT

Electrostatic

discharge

Human body model (HBM), per IEC 60749-26

Bus terminals and GND

±16000

V

(1)

By convention, the least positive (most negative) limit is designated as minimum in this data sheet.

6.4 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

3.15

5

5.5

V

–7

12

V

High-level input voltage (driver, driver enable, and receiver enable inputs)

2

V

Low-level input voltage (driver, driver enable, and receiver enable inputs)

0

0.8

V

Differential input voltage

–12

12

V

Output current, driver

–60

60

mA

Output current, receiver

–8

8

mA

Differential load resistance

54

60

Ω

Differential load capacitance

50

pF

Signaling rate

SN65HVD1780-Q1

115

Mbps

SN65HVD1781-Q1

1

SN65HVD1782-Q1

10

Operating free-air temperature (See the

Thermal Information table)

5-V supply

–40

105

°C

3.3-V supply

–40

125

Junction Temperature

–40

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information

SN65HVD1780-Q1

SN65HVD1781-Q1

SN65HVD1782-Q1

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

JEDEC high-K model

138

°C/W

JEDIC low-K model

242

°C/W

Junction-to-case (top) thermal resistance

61

°C/W

Junction-to-board thermal resistance

62

°C/W

Junction-to-top characterization parameter

3.8

°C/W

Junction-to-board characterization parameter

38.6

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W