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SN65DSI86IPAPQ1 Datasheet(PDF) 6 Page - Texas Instruments |
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SN65DSI86IPAPQ1 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 81 page  SN65DSI86-Q1 SLLSEJ5A – JULY 2014 – REVISED DECEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCCA, VCC –0.3 1.3 Supply voltage V VCCIO, VPLL –0.3 2.175 Input voltage All input terminals –0.5 2.175 V Operating temperature –40 85 °C Storage temperature, Tstg –65 105 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per AEC Q100-002 Classification –2000 2000 Level H2, all pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per Corner pins –750 750 AEC Q100-011 Classification Level Other pins –500 500 C4B (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCCA VCCA Power supply; analog circuits 1.14 1.2 1.26 V VCC VCC Power supply; digital circuits 1.14 1.2 1.26 V VCCIO VCCIO Power Supply; digital IOs. 1.65 1.8 1.98 V VPLL VPLL Power Supply, DisplayPort PLL 1.65 1.8 1.98 V VPSN Supply noise on any VCC terminal f(noise) > 1 MHz 0.05 V VDSI_PIN DSI input pin voltage range –50 1350 mV f(I2C) Local I2C input frequency 400 kHz fHS_CLK DSI HS clock input frequency 40 750 MHz ZL DP output differential load impedance 90 110 Ω TA Operating free-air temperature –40 85 °C TJ Operating junction temperature –40 105 °C 7.4 Thermal Information SN65DSI86-Q1 THERMAL METRIC(1) PAP UNIT 64 TERMINALS RθJA Junction-to-ambient thermal resistance 35.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 17.7 °C/W RθJB Junction-to-board thermal resistance 19.5 °C/W ψJT Junction-to-top thermal resistance metric (High-K board(1)) 0.7 °C/W ψJB Junction-to-board thermal resistance metric (High-K board(1)) 19.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: SN65DSI86-Q1 |
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