11.9 mm

17.0 mm

38.0 mm

L293, L293D

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SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016

10 Power Supply Recommendations

power down supply sequence order requirements.

Properly heatsinking the L293 when driving high-current is critical to design. The Rthj-amp of the L293 can be

reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heat

sink.

Figure 14 shows the maximum package power PTOT and the

θJA as a function of the side of two equal square

copper areas having a thickness of 35

μm (see Figure 14). In addition, an external heat sink can be used (see

Figure 12).

During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12

seconds.

The external heatsink or printed circuit copper area must be connected to electrical ground.

Figure 12. External Heat Sink Mounting Example (

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Product Folder Links: L293 L293D