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DAC8563-Q1 Datasheet(PDF) 4 Page - Texas Instruments

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Part # DAC8563-Q1
Description  Low-Power, Buffered, Voltage-Output DACs
Download  54 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DAC8563-Q1 Datasheet(HTML) 4 Page - Texas Instruments

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DAC7562-Q1, DAC7563-Q1
DAC8162-Q1, DAC8163-Q1
DAC8562-Q1, DAC8563-Q1
SLAS950A – MAY 2013 – REVISED JUNE 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted).
(1)
MIN
MAX
UNIT
AVDD to GND
–0.3
6
V
CLR, DIN, LDAC, SCLK and SYNC input voltage to GND
–0.3
AVDD + 0.3
V
VOUT[A, B] to GND
–0.3
AVDD + 0.3
V
VREFIN/VREFOUT to GND
–0.3
AVDD + 0.3
V
Operating temperature
–40
125
°C
Junction temperature, TJ max
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±2000
V(ESD)
Electrostatic discharge
All pins
±500
V
Charged-device model (CDM), per
AEC Q100-011
Corner pins (1, 5, 6, and 10)
±750
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
POWER SUPPLY
Supply voltage
AVDD to GND
2.7
5.5
V
DIGITAL INPUTS
Digital input voltage
CLR, DIN, LDAC, SCLK and SYNC
0
AVDD
V
REFERENCE INPUT
VREFIN
Reference input voltage
0
AVDD
V
TEMPERATURE RANGE
TA
Operating ambient temperature
–40
125
°C
7.4 Thermal Information
DACxx6x-Q1
THERMAL METRIC(1)
DGS (VSSOP)
UNIT
10 PINS
RθJA
Junction-to-ambient thermal resistance
173.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
48.5
°C/W
RθJB
Junction-to-board thermal resistance
79.9
°C/W
ψJT
Junction-to-top characterization parameter
1.7
°C/W
ψJB
Junction-to-board characterization parameter
68.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: DAC7562-Q1 DAC7563-Q1 DAC8162-Q1 DAC8163-Q1 DAC8562-Q1 DAC8563-Q1


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