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DAC8563-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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DAC8563-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 54 page DAC7562-Q1, DAC7563-Q1 DAC8162-Q1, DAC8163-Q1 DAC8562-Q1, DAC8563-Q1 SLAS950A – MAY 2013 – REVISED JUNE 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted). (1) MIN MAX UNIT AVDD to GND –0.3 6 V CLR, DIN, LDAC, SCLK and SYNC input voltage to GND –0.3 AVDD + 0.3 V VOUT[A, B] to GND –0.3 AVDD + 0.3 V VREFIN/VREFOUT to GND –0.3 AVDD + 0.3 V Operating temperature –40 125 °C Junction temperature, TJ max 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge All pins ±500 V Charged-device model (CDM), per AEC Q100-011 Corner pins (1, 5, 6, and 10) ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT POWER SUPPLY Supply voltage AVDD to GND 2.7 5.5 V DIGITAL INPUTS Digital input voltage CLR, DIN, LDAC, SCLK and SYNC 0 AVDD V REFERENCE INPUT VREFIN Reference input voltage 0 AVDD V TEMPERATURE RANGE TA Operating ambient temperature –40 125 °C 7.4 Thermal Information DACxx6x-Q1 THERMAL METRIC(1) DGS (VSSOP) UNIT 10 PINS RθJA Junction-to-ambient thermal resistance 173.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 48.5 °C/W RθJB Junction-to-board thermal resistance 79.9 °C/W ψJT Junction-to-top characterization parameter 1.7 °C/W ψJB Junction-to-board characterization parameter 68.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: DAC7562-Q1 DAC7563-Q1 DAC8162-Q1 DAC8163-Q1 DAC8562-Q1 DAC8563-Q1 |
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