2003-06-23

Page 2

BSS 83 P

Rev. 1.0

Thermal Characteristics

Parameter

Symbol

Unit

Values

min.

max.

typ.

Characteristics

Thermal resistance, junction - soldering point

( Pin 3 )

150

K/W

-

-

SMD version, device on PCB:

@ min. footprint

-

-

-

-

350

300

Electrical Characteristics, at

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain- source breakdown voltage

-60

-

V

-

Gate threshold voltage,

-1

-1.5

-2

Zero gate voltage drain current

µA

-1

-100

-0.1

-10

-

-

-

-10

-100

Gate-source leakage current

nA

Drain-source on-state resistance

-

2

3

W

Drain-source on-state resistance

-

1.4

2

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.