2004-06-02

Page 2

BSP613P

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - soldering point

(Pin 4)

-

-

19

K/W

Thermal resistance, junction - ambient, leaded

-

100

-

SMD version, device on PCB:

@ min. footprint

-

-

-

-

100

70

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain-source breakdown voltage

-60

-

-

V

-2.1

-3

-4

Zero gate voltage drain current

-

-

-0.1

-10

-1

-100

µA

Gate-source leakage current

-

-10

-100

nA

Drain-source on-state resistance

-

0.11

0.13

Ω

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.