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BSP613P Datasheet(PDF) 2 Page - Infineon Technologies AG |
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BSP613P Datasheet(HTML) 2 Page - Infineon Technologies AG |
2 / 8 page 2004-06-02 Page 2 BSP613P Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - soldering point (Pin 4) RthJS - - 19 K/W Thermal resistance, junction - ambient, leaded RthJA - 100 - SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 1) RthJA - - - - 100 70 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain-source breakdown voltage VGS=0, ID=-250µA V(BR)DSS -60 - - V Gate threshold voltage, VGS = VDS ID=-1mA VGS(th) -2.1 -3 -4 Zero gate voltage drain current VDS=-60V, VGS=0, Tj=25°C VDS=-60V, VGS=0, Tj=125°C IDSS - - -0.1 -10 -1 -100 µA Gate-source leakage current VGS=-20V, VDS=0 IGSS - -10 -100 nA Drain-source on-state resistance VGS=-10V, ID=2.9A RDS(on) - 0.11 0.13 Ω 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. |
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