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DLP3010FQK Datasheet(PDF) 6 Page - Texas Instruments

Part # DLP3010FQK
Description  DMD
Download  39 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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DLP3010FQK Datasheet(HTML) 6 Page - Texas Instruments

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DLP3010
DLPS051A – SEPTEMBER 2014 – REVISED APRIL 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
See
(1)
MIN
MAX
UNIT
Supply voltage for LVCMOS core logic(2)
VDD
–0.5
2.3
V
Supply voltage for LPSDR low speed interface
VDDI
Supply voltage for SubLVDS receivers(2)
–0.5
2.3
V
Supply voltage for HVCMOS and micromirror
VOFFSET
–0.5
11
V
electrode(2)(3)
Supply voltage VBIAS
Supply voltage for micromirror electrode(2)
–0.5
19
V
VRESET
Supply voltage for micromirror electrode(2)
–15
0.3
V
| VDDI–VDD |
Supply voltage delta (absolute value)(4)
0.3
V
| VBIAS–VOFFSET |
Supply voltage delta (absolute value)(5)
11
V
| VBIAS–VRESET |
Supply voltage delta (absolute value)(6)
34
V
Input voltage for other inputs LPSDR(2)
–0.5
VDD + 0.5
V
Input voltage
Input voltage for other inputs SubLVDS (2)(7)
–0.5
VDDI + 0.5
V
| VID |
SubLVDS input differential voltage (absolute value)(7)
810
mV
Input pins
IID
SubLVDS input differential current
10
mA
ƒclock
Clock frequency for low speed interface LS_CLK
130
MHz
Clock
frequency
ƒclock
Clock frequency for high speed interface DCLK
560
MHz
Temperature – operational (8)
–20
90
°C
TARRAY and TWINDOW
Temperature – non-operational(8)
–40
90
°C
Environmental
TDP
Dew Point - operating and non-operating
81
°C
Absolute Temperature delta between any point on the
|TDELTA|
30
°C
window edge and the ceramic test point TP1(9)
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device is not implied at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure above or below the Recommended Operating Conditions for extended periods may affect device
reliability.
(2)
All voltage values are with respect to the ground terminals (VSS). The following power supplies are all required to operate the DMD:
VSS, VDD, VDDI, VOFFSET, VBIAS, and VRESET.
(3)
VOFFSET supply transients must fall within specified voltages.
(4)
Exceeding the recommended allowable absolute voltage difference between VDDI and VDD may result in excessive current draw.
(5)
Exceeding the recommended allowable absolute voltage difference between VBIAS and VOFFSET may result in excessive current
draw.
(6)
Exceeding the recommended allowable absolute voltage difference between VBIAS and VRESET may result in excessive current draw.
(7)
This maximum input voltage rating applies when each input of a differential pair is at the same voltage potential. Sub-LVDS differential
inputs must not exceed the specified limit or damage may result to the internal termination resistors.
(8)
The highest temperature of the active array (as calculated by the Micromirror Array Temperature Calculation) or of any point along the
Window Edge as defined in Figure 18. The locations of thermal test points TP2 and TP3 in Figure 18 are intended to measure the
highest window edge temperature. If a particular application causes another point on the window edge to be at a higher temperature,
that point should be used.
(9)
Temperature delta is the highest difference between the ceramic test point 1 (TP1) and anywhere on the window edge as shown in
Figure 18. The window test points TP2 and TP3 shown in Figure 18 are intended to result in the worst case delta. If a particular
application causes another point on the window edge to result in a larger delta temperature, that point should be used.
6.2 Storage Conditions
applicable before the DMD is installed in the final product.
MIN
MAX
UNIT
Tstg
DMD storage temperature
-40
85
°C
Storage dew point - long-term(1)
24
°C
TDP
Storage dew point - short-term(2)
28
°C
(1)
Long-term is defined as the usable life of the device.
(2)
Dew points beyond the specified long-term dew point are for short-term conditions only, where short-term is defined as less than 60
cumulative days over the usable life of the device (operating, non-operating, or storage).
6
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