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SI4688-A10 Datasheet(PDF) 2 Page - Silicon Laboratories

Part # SI4688-A10
Description  Single-Chip, FM/HD/DAB/DAB Radio Receiver
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Manufacturer  SILABS [Silicon Laboratories]
Direct Link  http://www.silabs.com
Logo SILABS - Silicon Laboratories

SI4688-A10 Datasheet(HTML) 2 Page - Silicon Laboratories

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Digital Radio Receiver
Copyright © 2013 by Silicon Laboratories
05.07.2013
Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.
Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders
Si4688-A10
Single-Chip, FM/HD/DAB/DAB+ Radio Receiver
Selected Electrical Specifications
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
Ambient Temperature
TA
–40
25
85
°C
Analog Supply Voltage
VA
1.71
1.8
2.0
V
Interface Supply Voltage
VIO
1.62
1.8
3.6
V
Core Digital Supply Voltage
VCORE
1.62
1.8
2.0
V
Memory Supply Voltage
VMEM
1.62
1.8
2.0
V
Analog FM
Input Frequency
Frf
76
108
MHz
Seek Time
——
60
ms/ch
Input IP3
—96
dBµV
Sensitivity
SINAD = 26 dB
0.7
µV
FM HD
Input Frequency
Frf
87.5
108
MHz
Seek Time
120
ms/ch
DAB/DAB+
Input Frequency
Frf
168
240
MHz
Enable Acquisition Time
940
ms
Si4688-A10-GM (QFN)
Dimension
Min
Nom
Max
A
0.80
0.85
0.90
A1
0.00
0.02
0.05
b
0.18
0.25
0.30
D
7.00 BSC
D2
5.20
5.30
5.40
e
0.50 BSC
E
7.00 BSC
E2
5.20
5.30
5.40
L
0.30
0.40
0.50
aaa
0.15
bbb
0.10
ddd
0.05
eee
0.08
Notes:
1.
All dimensions are shown in millimeters (mm) unless otherwise
noted.
2.
Dimensioning and tolerancing per ASME Y14.5M-1994.
3.
This drawing conforms to JEDEC Outline MO-220, Variation
VKKD-4.
4.
Recommended card reflow profile is per the JEDEC/IPC J-
STD-020 specification for Small Body Components.
Si4688-A10-GD (WLCSP
)
Dimension
Min
Nom
Max
A
0.55
0.59
0.63
A1
0.18
0.20
0.22
b
0.22
0.27
0.32
D
3.20 BSC.
E
3.77 BSC.
d
0.40 BSC.
e
0.40 BSC.
D1
2.40 BSC.
E1
3.20 BSC.
aaa
0.10
bbb
0.10
ccc
0.03
ddd
0.15
eee
0.05
Notes:
1.
All dimensions shown are in millimeters (mm) unless otherwise
noted.
2.
Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3.
Primary datum "C" and seating plane are defined by the spherical
crowns of the solder balls.
4.
Dimension "b" is measured at the maximum solder bump diameter,
parallel to primary datum "C".
5.
Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.


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