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LMK00338 Datasheet(PDF) 24 Page - Texas Instruments

Part No. LMK00338
Description  8-Output Differential Clock Buffer/Level Translator
Download  33 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LMK00338 Datasheet(HTML) 24 Page - Texas Instruments

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0.2 mm,
1.2 mm,
4.6 mm, min
11.3 Thermal Management
Power dissipation in the LMK00338 device can be high enough to require attention to thermal management. For
reliability and performance reasons the die temperature should be limited to a maximum of 125 °C. That is, as an
estimate, TA (ambient temperature) plus device power dissipation times RθJA should not exceed 125 °C.
The package of the device has an exposed pad that provides the primary heat removal path as well as excellent
electrical grounding to the printed circuit board. To maximize the removal of heat from the package a thermal
land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the
package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package.
A recommended land and via pattern is shown in Figure 25. More information on soldering WQFN packages can
be obtained at: http://www.ti.com/packaging.
Figure 25. Recommended Land and Via Pattern
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground
plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite
side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but
should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in
Figure 25 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat
pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively
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Product Folder Links: LMK00338

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