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LM555CM/NOPB Datasheet(PDF) 4 Page - Texas Instruments

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Part # LM555CM/NOPB
Description  Timer
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LM555CM/NOPB Datasheet(HTML) 4 Page - Texas Instruments

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LM555
SNAS548D – FEBRUARY 2000 – REVISED JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
LM555CM, LM555CN(4)
1180
mW
Power Dissipation(3)
LM555CMM
613
mW
PDIP Package
Soldering (10 Seconds)
260
°C
Soldering
Vapor Phase (60 Seconds)
215
°C
Small Outline Packages (SOIC and
Information
VSSOP)
Infrared (15 Seconds)
220
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3)
For operating at elevated temperatures the device must be derated above 25°C based on a 150°C maximum junction temperature and a
thermal resistance of 106°C/W (PDIP), 170°C/W (S0IC-8), and 204°C/W (VSSOP) junction to ambient.
(4)
Refer to RETS555X drawing of military LM555H and LM555J versions for specifications.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±500(2)
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
The ESD information listed is for the SOIC package.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Supply Voltage
18
V
Temperature, TA
0
70
°C
Operating junction temperature, TJ
70
°C
6.4 Thermal Information
LM555
THERMAL METRIC(1)
PDIP
SOIC
VSSOP
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
106
170
204
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: LM555


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