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CDCM6208V1FRGZR Datasheet(PDF) 10 Page - Texas Instruments

Part No. CDCM6208V1FRGZR
Description  2:8 Clock Generator, Jitter Cleaner with Fractional Dividers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCM6208V1FRGZR Datasheet(HTML) 10 Page - Texas Instruments

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CDCM6208V1F
SCAS943 – MAY 2015
www.ti.com
8.10 Differential Input Characteristics (PRI_REF, SEC_REF)
VDD_PRI, VDD_SEC = 1.71 V to 1.89 V, 2.375 V to 2.625 V, 3.135 V to 3.465 V, TA = –40°C TO 85°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fIN
Reference and Bypass Input Frequency
0.008
250
MHz
VDD_PRI/SEC = 2.5/3.3 V
0.2
1.6
VPP
Differential Input Voltage Swing, Peak-to-
VI
Peak
VDD_PRI/SEC = 1.8 V
0.2
1
VPP
VDD_PRI/V
VDD_PRI/V
VICM
Input Common Mode Voltage
CML input signaling, R4[7:6] = 00
DD_SEC-
DD_SEC-
V
0.4
0.1
LVDS, VDD_PRI/SEC
= 1.8/2.5/3.3 V,
VICM
Input Common Mode Voltage
0.8
1.2
1.5
V
R4[7:6] = 01, R4.1 = d.c.,
R4.0 = d.c.
LVDS (Q4[7:6,4:3] = 01)
15
65
mVpp
VHYST
Input hysteresis
CML (Q4[7:6,4:3] = 00)
20
85
mVpp
IIH
Input High Current
VDD_PRI/SEC = 3.465 V, VIH = 3.465 V
30
µA
IIL
Input Low Current
VDD_PRI/SEC = 3.465V, VIL = 0 V
-30
µA
ΔV/ΔT
Reference Input Edge Rate
20% - 80%
0.75
V/ns
IDCDIFF
Reference Input Duty Cycle
30%
70%
CIN
Input Capacitance
2.7
pF
8.11 Crystal Input Characteristics (SEC_REF)
VDD_SEC = 1.71 to 1.89 V, 2.375 V to 2.625 V, 3.135 V to 3.465 V,TA = –40°C to 85°C
PARAMETER
MIN
TYP
MAX
UNIT
MODE OF OSCILLATION
FUNDAMENTAL
See note (1)
10
30.72
MHz
Frequency
See note (2)
30.73
50
MHz
10 MHz
150(3)
Equivalent Series Resistance (ESR)
25 MHz
70(4)
Ω
50 MHz
30(5)
1.8 V / 3.3 V SEC_REFP
3.5
4.5
5.5
On-chip load capacitance
1.8 V SEC_REFN
5.5
7.25
8.5
pF
3.3 V SEC_REFN
6.5
7.34
8.5
Drive Level
See note (6)
200
µW
(1)
Verified with crystals specified for a load capacitance of CL=8pF, the pcb related capacitive load was estimated to be 2.3pF, and
completed with a load capacitors of 4pF on each crystal terminal connected to GND. XTALs tested: NX3225GA 10MHz EXS00A-
CG02813 CRG, NX3225GA 19.44MHz EXS00A-CG02810 CRG, NX3225GA 25MHz EXS00A-CG02811 CRG, and NX3225GA
30.72MHz EXS00A-CG02812 CRG.
(2)
For 30.73 MHz to 50 MHz, it is recommended to verify sufficient negative resistance and initial frequency accuracy with the crystal
vendor. The 50 MHz use case was verified with a NX3225GA 50MHz EXS00A-CG02814 CRG. To meet a minimum frequency error, the
best choice of the XTAL was one with CL = 7pF instead of CL = 8pF.
(3)
With NX3225GA_10M the measured remaining negative resistance on the EVM is 6430
Ω (43 x margin)
(4)
With NX3225GA_25M the measured remaining negative resistance on the EVM is 1740
Ω (25 x margin)
(5)
With NX3225GA_50M the measured remaining negative resistance on the EVM is 350
Ω (11 x margin)
(6)
Maximum drive level measured was 145 µW; XTAL should at least tolerate 200 µW
10
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