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CDCM6208V1FRGZR Datasheet(PDF) 8 Page - Texas Instruments

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Part No. CDCM6208V1FRGZR
Description  2:8 Clock Generator, Jitter Cleaner with Fractional Dividers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCM6208V1FRGZR Datasheet(HTML) 8 Page - Texas Instruments

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CDCM6208V1F
SCAS943 – MAY 2015
www.ti.com
8.5 Thermal Information, Airflow = 150 LFM
(1) (2) (3) (4)
CDCM6208
THERMAL METRIC(1)
RGZ
UNIT
48 PINS
RθJA
Junction-to-ambient thermal resistance
21.8
RθJC(top)
Junction-to-case (top) thermal resistance
RθJB
Junction-to-board thermal resistance
6.61
°C/W
ψJT
Junction-to-top characterization parameter
0.37
ψJB
Junction-to-board characterization parameter
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.06
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(3)
Connected to GND with 36 thermal vias (0.3 mm diameter).
(4)
θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN.
8.6 Thermal Information, Airflow = 250 LFM
(1) (2) (3) (4)
CDCM6208
THERMAL METRIC(1)
RGZ
UNIT
48 PINS
RθJA
Junction-to-ambient thermal resistance
19.5
RθJC(top)
Junction-to-case (top) thermal resistance
RθJB
Junction-to-board thermal resistance
6.6
°C/W
ψJT
Junction-to-top characterization parameter
0.45
ψJB
Junction-to-board characterization parameter
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.06
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(3)
Connected to GND with 36 thermal vias (0.3 mm diameter).
(4)
θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN.
8.7 Thermal Information, Airflow = 500 LFM
(1) (2) (3) (4)
CDCM6208
THERMAL METRIC(1)
RGZ
UNIT
48 PINS
RθJA
Junction-to-ambient thermal resistance
17.7
RθJC(top)
Junction-to-case (top) thermal resistance
RθJB
Junction-to-board thermal resistance
6.58
°C/W
ψJT
Junction-to-top characterization parameter
0.58
ψJB
Junction-to-board characterization parameter
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.05
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).
(3)
Connected to GND with 36 thermal vias (0.3 mm diameter).
(4)
θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN.
8
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Product Folder Links: CDCM6208V1F


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