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CDCM6208V1FRGZR Datasheet(PDF) 2 Page - Texas Instruments

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Part No. CDCM6208V1FRGZR
Description  2:8 Clock Generator, Jitter Cleaner with Fractional Dividers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCM6208V1FRGZR Datasheet(HTML) 2 Page - Texas Instruments

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CDCM6208V1F
SCAS943 – MAY 2015
www.ti.com
Table of Contents
Characteristics ......................................................... 15
1
Features .................................................................. 1
8.20
Device Individual Block Current Consumption...... 16
2
Applications ........................................................... 1
8.21
Worst Case Current Consumption ........................ 17
3
Description ............................................................. 1
8.22
I2C TIMING .......................................................... 18
4
Simplified Schematics........................................... 1
8.23
SPI Timing Requirements ..................................... 19
5
Revision History..................................................... 2
8.24
Typical Characteristics ......................................... 20
6
Description (continued)......................................... 3
9
Parameter Measurement Information ................ 22
7
Pin Configuration and Functions ......................... 3
9.1
Characterization Test Setup ................................... 22
8
Specifications......................................................... 6
10
Detailed Description ........................................... 28
8.1
Absolute Maximum Ratings ..................................... 6
10.1
Overview ............................................................... 28
8.2
ESD Ratings.............................................................. 6
10.2
Functional Block Diagram ..................................... 28
8.3
Recommended Operating Conditions ....................... 7
10.3
Feature Description............................................... 29
8.4
Thermal Information, Airflow = 0 LFM ..................... 7
10.4
Device Functional Modes...................................... 30
8.5
Thermal Information, Airflow = 150 LFM ................. 8
10.5
Programming......................................................... 38
8.6
Thermal Information, Airflow = 250 LFM ................. 8
10.6
Register Maps ....................................................... 42
8.7
Thermal Information, Airflow = 500 LFM ................. 8
11
Application and Implementation........................ 53
8.8
Single Ended Input Characteristics .......................... 9
11.1
Application Information.......................................... 53
8.9
Single Ended Input Characteristics (PRI_REF,
11.2
Typical Applications .............................................. 53
SEC_REF) ................................................................. 9
12
Power Supply Recommendations ..................... 72
8.10
Differential Input Characteristics (PRI_REF,
SEC_REF) ............................................................... 10
12.1
Power Rail Sequencing, Power Supply Ramp Rate,
and Mixing Supply Domains .................................... 72
8.11
Crystal Input Characteristics (SEC_REF) ............. 10
13
Layout................................................................... 74
8.12
Single Ended Output Characteristics (STATUS1,
STATUS0, SDO, SDA) ............................................ 11
13.1
Layout Guidelines ................................................. 74
8.13
PLL Characteristics ............................................... 11
13.2
Layout Example .................................................... 74
8.14
LVCMOS Output Characteristics .......................... 12
14
Device and Documentation Support ................. 80
8.15
LVPECL (High-Swing CML) Output
14.1
Trademarks ........................................................... 80
Characteristics ......................................................... 13
14.2
Documentation Support ....................................... 80
8.16
CML Output Characteristics .................................. 13
14.3
Electrostatic Discharge Caution ............................ 80
8.17
LVDS (Low-Power CML) Output Characteristics . 14
14.4
Glossary ................................................................ 80
8.18
HCSL Output Characteristics............................... 14
15
Mechanical, Packaging, and Orderable
8.19
Output Skew and Sync to Output Propagation Delay
Information ........................................................... 80
5 Revision History
DATE
REVISION
NOTES
May 2015
*
Initial release.
2
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: CDCM6208V1F


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