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CDCLVP2108 Datasheet(PDF) 22 Page - Texas Instruments

Part # CDCLVP2108
Description  16-LVPECL Output, High-Performance Clock Buffer
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCLVP2108 Datasheet(HTML) 22 Page - Texas Instruments

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5,0mm(min)
1,2mm(typ)
0,33mm(typ)
CDCLVP2108
SCAS878C – MAY 2009 – REVISED JANUARY 2016
www.ti.com
11 Layout
11.1 Layout Guidelines
Power consumption of the CDCLVP2108 can be high enough to require attention to thermal management. For
reliability and performance reasons, the die temperature must be limited to a maximum of 125°C. That is, as an
estimate, ambient temperature (TA) plus device power consumption times RθJA must not exceed 125°C.
The device package has an exposed pad that provides the primary heat removal path to the printed circuit board
(PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a
ground plane must be incorporated into the PCB within the footprint of the package. The exposed pad must be
soldered down to ensure adequate heat conduction out of the package. Figure 24 shows a recommended land
and via pattern.
11.2 Layout Example
Figure 24. Recommended PCB Layout
11.3 Thermal Considerations
The CDCLVP2108 supports high temperatures on the printed circuit board (PCB) measured at the thermal pad.
The system designer must ensure that the maximum junction temperature is not exceeded.
ΨJB can allow the
system designer to measure the board temperature with a fine gauge thermocouple and back calculate the
junction temperature using Equation 1. Note that
ΨJB is close to RθJB because 75 to 95% of the heat of a device
is dissipated by the PCB. Further information can be found at SPRA953 and SLUA566.
Tjunction = TPCB + ( ΨJB × Power)
(1)
Example:
Calculation of the junction-lead temperature with a 4-layer JEDEC test board using four thermal vias:
TPCB = 105°C
ΨJB = 8.3°C/W
PowerinclTerm = Imax × Vmax = 677 mA × 3.6 V = 2437 mW (maximum power consumption including
termination resistors)
PowerexclTerm = 1833 mW (maximum power consumption excluding termination resistors, see SLYT127
for further details)
ΔTJunction = ΨJB × PowerexclTerm = 8.3°C/W × 1833 mW = 15.21°C
TJunction = ΔTJunction + TChassis = 15.21°C + 105°C = 120.21°C (the maximum junction temperature of
125°C is not violated)
22
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