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CDCL1810RGZT Datasheet(PDF) 6 Page - Texas Instruments

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Part No. CDCL1810RGZT
Description  Output, High-Performance Clock Distributor
Download  33 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CDCL1810RGZT Datasheet(HTML) 6 Page - Texas Instruments

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CDCL1810
SLLS781D – FEBRUARY 2007 – REVISED NOVEMBER 2014
www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
(1)
Over operating free-air temperature range (unless otherwise noted).
MIN
MAX
UNIT
VDD, AVDD
Supply voltage(2)
–0.3
2.5
V
VLVDS
Voltage range at LVDS input pins(2)
–0.3
VDD+0.6
V
VI
Voltage range at all non-LVDS input pins(2)
–0.3
VDD+0.6
V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
condition is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
8.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
+150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
2000
pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification
1500
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 1500-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted).
MIN
NOM
MAX
UNIT
VDD
Digital supply voltage
1.7
1.8
1.9
V
AVD
Analog supply voltage
1.7
1.8
1.9
V
D
TA
Ambient temperature (no airflow, no heatsink)
–40
+85
°C
TJ
Junction temperature
+105
°C
8.4 Thermal Information
CDCL1810
THERMAL METRIC(1)
RGZ Package
UNIT
48 PINS
28.3, Airflow = 0 LFM
RθJA
Junction-to-ambient thermal resistance(2)
22.4, Airflow = 50 LFM
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
20.5
RθJC(bot)
Junction-to-case (bottom) thermal resistance
5.3
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
No heatsink; power uniformly distributed; 36 ground vias (6 x 6 array) tied to the thermal exposed pad; 4-layer high-K board.
8.5
DC Electrical Characteristics
Over recommended operating conditions (unless otherwise noted).
TEST CONDITIONS
MIN
TYP
MAX
UNIT
All outputs enabled; VDD = VDD,typ
IVDD
Total current from digital 1.8-V supply
212
mA
650MHz LVDS input
All outputs enabled; AVDD = VDD,typ
IAVDD
Total current from analog 1.8-V supply
16
mA
650MHz LVDS input
VIL,CMOS
Low level CMOS input voltage
VDD = 1.8 V
–0.2
0.6
V
VIH,CMOS
High level CMOS input voltage
VDD = 1.8 V
VDD –0.6
VDD
V
6
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Copyright © 2007–2014, Texas Instruments Incorporated
Product Folder Links: CDCL1810


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