6

Revised: 08/11/15

Specifications are subject to change without notice.

©2015 Littelfuse, Inc

Standard Unidirectional SIDACs

Kxxx0yU SIDAC Series

6

Dimensions

Inches

Millimeters

Min

Max

Min

Max

A

0.049

0.065

1.250

1.650

B

0.157

0.177

3.990

4.500

C

0.100

0.110

2.540

2.790

D

0.078

0.090

1.980

2.290

E

0.030

0.060

0.780

1.520

F

-

0.008

-

0.203

G

0.194

0.208

4.930

5.280

H

0.006

0.012

0.152

0.305

I

0.070

-

1.800

-

J

0.082

-

2.100

-

K

-

0.090

-

2.300

L

0.082

-

2.100

-

DO-214AC (SMA)

A

D

E

G

F

H

C

B

(all dimensions in mm)

I

L

K

J

Solder Pads

Dimensions

Dimension

Inches

Millimeters

Max

Max

Min

Max

A

1.000

-

25.40

-

B

0.230

0.300

5.80

7.60

C

0.028

0.034

0.71

0.86

D

0.104

0.140

2.60

3.60

Dimensions — DO-15

A

A

B

D

C

Temperature Measuring Point

Physical Specifications

Test

Specifications and Conditions

High Temperature

Voltage Blocking

MIL-STD-750: Method 1040, Condition A

Rated V

hours

Temperature Cycling

MIL-STD-750: Method 1051

-40°C to 150°C, 15-minute dwell, 100

cycles

Biased Temperature &

Humidity

EIA/JEDEC: JESD22-A101

80% min V

hours

High Temp Storage

MIL-STD-750: Method 1031

150°C, 1008 hours

Low-Temp Storage

-40°C, 1008 hours

Thermal Shock

MIL-STD-750: Method 1056

0°C to 100°C, 5-minute dwell,

10-second transfer, 10 cycles

Resistance to

Solder Heat

MIL-STD-750: Method 2031

260°C, 10 seconds

Solderability

ANSI/J-STD-002: Category 3

Lead Bend

MIL-STD-750: Method 2036, Condition E

Terminal Finish

100% Matte Tin Plated

Body Material

UL recognized epoxy meeting flammability

classification 94V-0

Lead Material

Copper Alloy

Design Considerations

Careful selection of the correct device for the application’s

operating parameters and environment will go a long

way toward extending the operating life of the Thyristor.

Overheating and surge currents are the main killers of

SIDACs. Correct mounting, soldering, and forming of the

leads also help protect against component damage.

Reliability/Environmental Tests