HBL5006 Series

http://onsemi.com

6

PACKAGE DIMENSIONS

SOD−523

CASE 502

ISSUE E

NOTES:

6. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

7. CONTROLLING DIMENSION: MILLIMETERS.

8. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.

MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

9. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-

TRUSIONS, OR GATE BURRS.

E

D

−X−

−Y−

b

2X

M

0.08

X

Y

A

H

c

DIM

MIN

NOM

MAX

MILLIMETERS

D

1.10

1.20

1.30

E

0.70

0.80

0.90

A

0.50

0.60

0.70

b

0.25

0.30

0.35

c

0.07

0.14

0.20

L

0.30 REF

H

1.50

1.60

1.70

12

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

E

E

RECOMMENDED

TOP VIEW

SIDE VIEW

2X

BOTTOM VIEW

L2

L

2X

2X

0.48

0.40

2X

1.80

DIMENSION: MILLIMETERS

PACKAGE

OUTLINE

L2

0.15

0.20

0.25