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TPA6130A2 Datasheet(PDF) 29 Page - Texas Instruments |
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TPA6130A2 Datasheet(HTML) 29 Page - Texas Instruments |
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29 / 39 page  20 1 19 18 17 16 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Audio Source 0.47uf 0.47uf 0.47uf 0.47uf 1uf 1uf 1uf VDD 1uf VDD Top Layer Ground Pour and PowerPad Top Layer Signal Traces Via to bottom Ground Plane It is recommended to place a top layer ground pour for shielding around TPA6130A2 and connect to lower main PCB ground plane by multiple vias Pad to top layer ground pour Place decoupling caps as close to TPA6120A2 pins as possible Keep vias to ground plane away from top layer ground pads to distribute inductances TPA6130A2 HPLEFT HPRIGHT Minimize charge pump cap series resistance. Keep close to pins with zero vias. TPA6130A2 www.ti.com SLOS488F – NOVEMBER 2006 – REVISED MARCH 2015 Layout Example (continued) Figure 49. RTJ (WQFN) Package Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 29 Product Folder Links: TPA6130A2 |
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