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TPA3110D2-Q1 Datasheet(PDF) 4 Page - Texas Instruments

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Part # TPA3110D2-Q1
Description  Filter-Free Stereo Class-D Audio Power Amplifier
Download  36 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPA3110D2-Q1 Datasheet(HTML) 4 Page - Texas Instruments

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TPA3110D2-Q1
SLOS794B – SEPTEMBER 2012 – REVISED SEPTEMBER 2015
www.ti.com
Pin Functions (continued)
PIN
TYPE
DESCRIPTION
NO.
NAME
Power supply for left channel H-bridge. Right channel and left channel power supply inputs
27
PVCCL
P
are connect internally.
Power supply for left channel H-bridge. Right channel and left channel power supply inputs
28
PVCCL
P
are connect internally.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
AVCC, PVCC
–0.3
30
V
–0.3
VCC + 0.3
V
SD, GAIN0, GAIN1, PBTL, FAULT(2)
< 10
V/ms
Interface pin
VI
voltage
PLIMIT
–0.3
GVDD + 0.3
V
RINN, RINP, LINN, LINP
–0.3
6.3
V
BTL: PVCC > 15 V
4.8
Minimum load
RL
BTL: PVCC
≤ 15 V
3.2
resistance
PBTL
3.2
Continuous total power dissipation
See the Thermal Information Table
TA
Operating free-air temperature
–40
125
°C
TJ
Operating junction temperature(3)
–40
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100-k
Ω resistor in series
with the pins, per application note SLUA626.
(3)
The TPA3110D2-Q1 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal
protection shutdown. See TI Technical Brief SLMA002 for more information about using the TSSOP thermal pad.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±4000
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per AEC Q100-011
±250
V
Machine Model (MM) per JESD22-A115
±200
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage
PVCC, AVCC
8
26
V
VIH
High-level input voltage
SD, GAIN0, GAIN1, PBTL
2
V
VIL
Low-level input voltage
SD, GAIN0, GAIN1, PBTL
0.8
V
VOL
Low-level output voltage
FAULT, RPULL-UP = 100k, VCC = 26 V
0.8
V
IIH
High-level input current
SD, GAIN0, GAIN1, PBTL, VI = 2 V, VCC = 18 V
50
µA
IIL
Low-level input current
SD, GAIN0, GAIN1, PBTL, VI = 0.8 V, VCC = 18 V
5
µA
TA
Operating free-air temperature
–40
125
°C
4
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