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F861KJ223M310C Datasheet(PDF) 10 Page - Kemet Corporation |
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F861KJ223M310C Datasheet(HTML) 10 Page - Kemet Corporation |
10 / 19 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com F3001_F861_X2_310 • 5/13/2015 10 Film Capacitors AC Line EMI Suppression and RC Networks – F861 Series Metallized Polypropylene Film, Class X2, 310 VAC Manual Soldering Recommendations Following is the recommendation for manual soldering with a soldering iron. The soldering iron tip temperature should be set at350°C(+10°Cmaximum)withthesoldering duration not to exceed more than 3 seconds. Recommended Soldering Temperature 0 50 100 150 200 250 300 350 400 0 1 2 3 4 5 6 7 8 Soldering time (sec) Soldering Process The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder. This has increased the liquidus temperature from that of 183ºC for SnPb eutectic alloy to 217 – 221ºC for the new alloys. As a result, the heat stress to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 – 170ºC). Wave soldering can be destructive, especially for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm), and great care has to be taken during soldering. The recommendedsolderprofilesfromKEMETshouldbeused.PleaseconsultKEMETwithanyquestions.Ingeneral,thewavesolderingcurve from IEC Publication 61760-1 Edition 2 serves as a solid guideline for successful soldering. Please see Figure 1. Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessoftheabovethe recommended limits may result to degradation or permanent damage to the capacitors. Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert through- holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven,ifthrough-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended. Please allow time for the capacitor surface temperature to return to a normal temperature before the second soldering cycle. Wave Soldering Recommendations 0 50 100 150 200 250 300 0 40 80 120 160 200 240 Time (s) ca 2°C/s ca 3.5°C/s typical ca 5°C/s Cooling 2+3s max 115°C max Tpreheat ΔT <150°C 100°C Preheating Typical First wave Second wave 260°C |
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