PCM1753, PCM1754, PCM1755

SLES092D – APRIL 2010 – REVISED AUGUST 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

–0.3

6.5

V

Ground voltage differences

AGND, DGND

±0.1

V

Input voltage

–0.3

6.5

V

Input current (any pins except supplies)

±10

mA

Ambient temperature under bias

–40

85

°C

Junction temperature

150

°C

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-

maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Voltage range

4.5

5

5.5

V

7.4 Thermal Information

PCM175x

DBQ (SSOP)

UNIT

16 PINS

Junction-to-ambient thermal resistance

104.1

°C/W

Junction-to-case (top) thermal resistance

53

°C/W

Junction-to-board thermal resistance

46.9

°C/W

Junction-to-top characterization parameter

10.3

°C/W

Junction-to-board characterization parameter

46.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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