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REF3320AIDBZT Datasheet(PDF) 4 Page - Texas Instruments

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Part # REF3320AIDBZT
Description  Drift Voltage Reference
Download  32 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

REF3320AIDBZT Datasheet(HTML) 4 Page - Texas Instruments

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REF3312, REF3318, REF3320, REF3325, REF3330, REF3333
SBOS392E – AUGUST 2007 – REVISED OCTOBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted).
(1)
MIN
MAX
UNIT
Input voltage
7.5
V
Voltage
Output voltage
5
V
Current
Output short-circuit, ISC
(2)
180
mA
Operating temperature
–50
150
°C
Temperature
Junction temperature, TJ
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
See the Power-Supply Recommendations section of this data sheet.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
–4000
4000
Electrostatic
V(ESD)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
–1000
1000
V
discharge
Machine model (MM)
–200
200
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted).
MIN
NOM
MAX
UNIT
VIN
Supply input voltage(1)
VOUT + 0.2
5.5
V
IOUT
Output current range
–30
30
mA
(1)
The minimum supply voltage for the REF3312 is 1.8 V.
7.4 Thermal Information
REF3325,
REF33xx
REF3330
THERMAL METRIC(1)
UNIT
DCK (SC70)
DBZ (SOT-23)
RSE (UQFN)
3 PINS
3 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
279.7
313.1
61.2
RθJC(top)
Junction-to-case (top) thermal resistance
136.3
144.0
32.6
RθJB
Junction-to-board thermal resistance
56.9
109.3
16.0
°C/W
ψJT
Junction-to-top characterization parameter
11.0
18.2
1.3
ψJB
Junction-to-board characterization parameter
56.1
107.9
16.0
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2007–2014, Texas Instruments Incorporated
Product Folder Links: REF3312 REF3318 REF3320 REF3325 REF3330 REF3333


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