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REF3020AIDBZTG4 Datasheet(PDF) 4 Page - Texas Instruments |
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REF3020AIDBZTG4 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page REF3012, REF3020, REF3025, REF3030, REF3033, REF3040 SBVS032G – MARCH 2002 – REVISED NOVEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, V+ to V– 7.0 V Output short-circuit current(2) Continuous Operating temperature –40 125 °C Junction temperature 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short circuit to ground. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions at TA = 25°C, VIN = 5 V, and ILOAD = 0 mA (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage VREF + 0.05 (1) 5.5 V ILOAD Load current 25 mA TA Operating temperature –40 125 °C (1) For IL > 0, see Typical Characteristics. Minimum supply voltage for REF3012 is 1.8 V . 7.4 Thermal Information REF30xx THERMAL METRIC(1) DBZ (SOT-23) UNIT 3 PINS RθJA Junction-to-ambient thermal resistance 297.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 128.5 °C/W RθJB Junction-to-board thermal resistance 91.7 °C/W ψJT Junction-to-top characterization parameter 12.8 °C/W ψJB Junction-to-board characterization parameter 90.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2002–2015, Texas Instruments Incorporated Product Folder Links: REF3012 REF3020 REF3025 REF3030 REF3033 REF3040 |
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